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Intern - SSD Process Engineer

🏢 Micron Technology

📍 Location: Perai, Penang, Malaysia

🏭 Industry: Engineering

👤 Contact Person: N/A

✉️ Contact Email: N/A

📞 Contact Phone: N/A

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Job Description 📝

Our vision is to transform how the world uses information to enrich life for

all

.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Project Title

Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement

Description

Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA).

The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations.

Scope

Selective Solder Tooling Enhancement (SS)

Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability

Address tooling‑related contributors to process variation during selective solder operations

BOL Conversion Readiness Enhancement (CF, SS, EA)

Develop and implement a tooling selection system defining required toolings for each product conversion across BOL

Standardize tooling

requirements

to eliminate ambiguity during CF, SS and EA conversions

Improve conversion clarity, reduce human dependency and minimize conversion‑related errors

Deliverables

Qualify and release selective solder tooling enhancements, including:

Uflex quick‑change gripper

Fixed preheater jig positioning standardization

Hold‑down unit design improvements

BOL Tooling Selection System

Tooling selection system covering CF, SS and EA processes

Clear definition of mandatory toolings required for each product conversion

Standardized conversion tooling guidance to reduce setup confusion and mis‑tooling

Expected Outcomes/Impact

Improved selective solder process robustness and repeatability

Reduced conversion errors and tooling‑related setup issues

Faster, more consistent BOL product conversions

Reduce tribal‑knowledge dependency during conversion

Supporting Teams

Process Engineering

Tooling/Equipment Engineering

Stretch Opportunities

Expand tooling selection system to other area apart from BOL processes

Requirements

Preferred equipped with Engineering graduate background with Mechanical Engineering, Manufacturing Engineering / Industrial Engineering.

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